The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Oct. 30, 2020
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Rahul Agarwal, Santa Clara, CA (US);
Brett P. Wilkerson, Austin, TX (US);
Raja Swaminathan, Austin, TX (US);
Assignee:
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/5383 (2013.01); H01L 24/20 (2013.01); H01L 24/82 (2013.01); H01L 2224/2101 (2013.01);
Abstract
A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways having a second density that is different from the first density.