logo

For the Inventor, By the Inventor

Austin, TX, United States of America

Brett P Wilkerson

This inventor holds 28 USPTO granted patents and 11 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Advanced Micro Devices Corporation, Freescale Semiconductor,inc.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brett P Wilkerson. Retrieved from https://idiyas.com/inventor/brett-p-wilkerson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 76(Granted Patents)


Company Filing History:

goldMedal23 out of 13,168 
 
Advanced Micro Devices Corporation
 patents
silverMedal5 out of 5,491 
 
Freescale Semiconductor,inc.
 patents

Years Active: 2007-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Thermal Management
3D Stacking
Hybrid Bonding
Interconnects
Semiconductor Devices
Molded Chip Packages
Photonic Integrated Circuits
Die Reuse
Flip-Chip Reliability
Anchor Structures
Fan-Out Modules
Voltage Regulators
28 patents (USPTO):Explore Patents
1. 12721159 - Structural thermal interfacing for lidded semiconductor packages (2026-08-25),
2. 12424560 - Semiconductor chip device (2025-09-23),
3. 12374645 - Electronic device including dies and an interconnect coupled to the dies and processes of forming the same (2025-07-29),
4. 12278150 - Semiconductor package with annular package lid structure (2025-04-14),
5. 12276850 - Fanout module integrating a photonic integrated circuit (2025-04-14),
6. 12266611 - Mixed density interconnect architectures using hybrid fan-out (2025-04-01),
7. 12266585 - Arrangement and thermal management of 3D stacked dies (2025-04-01),
8. 12249519 - Molded chip package with anchor structures (2025-03-11),
9. 12165981 - 3D semiconductor package with die-mounted voltage regulator (2024-12-10),
10. 12107075 - Hybrid bonded interconnect bridging (2024-10-01),
11. 11911839 - Low temperature hybrid bonding (2024-02-27),
12. 11855061 - Offset-aligned three-dimensional integrated circuit (2023-12-26),
13. 11804479 - Scheme for enabling die reuse in 3D stacked products (2023-10-31),
14. 11742301 - Fan-out package with reinforcing rivets (2023-08-29),
15. 11709327 - Fanout module integrating a photonic integrated circuit (2023-07-25),

Title: The Innovations of Brett P. Wilkerson: A Pioneer in Semiconductor Technology

Introduction: Brett P. Wilkerson, an accomplished inventor based in Austin, TX, is known for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 21 patents, Wilkerson has been instrumental in advancing the design and functionality of semiconductor packages, enhancing their efficiency and performance.

Latest Patents: Among his latest innovations, Wilkerson has developed two noteworthy patents, including a molded chip package with anchor structures. This invention introduces a semiconductor chip package featuring a package substrate designed to enhance the stability of semiconductor chips. The package incorporates plural metal anchor structures that project away from the substrate, effectively anchoring the molding layer and ensuring robustness.

Another significant patent is the 3D semiconductor package with a die-mounted voltage regulator. This invention showcases a dual-surface package substrate where a voltage regulator is integrated into the semiconductor package, optimizing the management of supply voltage and providing a regulated output for improved circuit functionality.

Career Highlights: Throughout his career, Brett P. Wilkerson has held vital positions in leading technology companies. He has worked with renowned organizations such as Advanced Micro Devices Corporation and Freescale Semiconductor, where he has utilized his expertise to push the boundaries of semiconductor design.

Collaborations: Wilkerson has collaborated with esteemed colleagues in the industry, including Rahul Kumar Agarwal and Milind S. Bhagavat. These partnerships have fostered innovation and creativity in developing cutting-edge semiconductor solutions.

Conclusion: Brett P. Wilkerson's contributions to the semiconductor industry are noteworthy, marked by his innovative patents and collaborative efforts. His work continues to influence the design and performance of semiconductor packages, reinforcing his reputation as a leading inventor in this technological field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…