The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Aug. 19, 2019
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Rahul Agarwal, Livermore, CA (US);
Milind S. Bhagavat, Los Altos, CA (US);
Priyal Shah, San Jose, CA (US);
Chia-Hao Cheng, Hsinchu, TW;
Brett P. Wilkerson, Austin, TX (US);
Lei Fu, Austin, TX (US);
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Abstract
Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a fan-out redistribution layer (RDL) structure that has plural stacked polymer layers, plural metallization layers, plural conductive vias interconnecting adjacent metallization layers of the metallization layers, and plural rivets configured to resist delamination of one or more of the polymer layers. Each of the plural rivets includes a first head, a second head and a shank connected between the first head and the second head. The first head is part of one of the metallization layers. The shank includes at least one of the conductive vias and at least one part of another of the metallization layers.