The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jun. 17, 2022
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Priyal Shah, Santa Clara, CA (US);
Milind S. Bhagavat, Broomfield, CO (US);
Brett P. Wilkerson, Austin, TX (US);
Lei Fu, Austin, TX (US);
Rahul Agarwal, Livermore, CA (US);
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Abstract
Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.