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For the Inventor, By the Inventor

Jiangsu, China

Qiuxiao Qian

This inventor holds 15 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Fairchild Semiconductor Corporation, Fairchild Semiconductor Corporatio. Active years: 2010-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qiuxiao Qian. Retrieved from https://idiyas.com/inventor/qiuxiao-qian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 86.7

 

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 70(Granted Patents)


Location History:

  • Suzhou Jiangsu, CN (2012)
  • Singapore, CN (2010 - 2013)
  • Suzhou, CN (2011 - 2013)
  • Jiangsu, CN (2010 - 2014)

Company Filing History:

goldMedal14 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
silverMedal1 out of 1 
 
Fairchild Semiconductor Corporatio
 patent

Years Active: 2010-2014

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15 patents (USPTO):Explore Patents
1. 8674490 - Semiconductor die package including IC driver and bridge (2014-03-18),
2. 8421204 - Embedded semiconductor power modules and packages (2013-04-16),
3. 8389338 - Embedded die package on package (POP) with pre-molded leadframe (2013-03-05),
4. 8367481 - Four MOSFET full bridge module (2013-02-05),
5. 8138585 - Four mosfet full bridge module (2012-03-20),
6. 8063474 - Embedded die package on package (POP) with pre-molded leadframe (2011-11-22),
7. 8063472 - Semiconductor package with stacked dice for a buck converter (2011-11-22),
8. 8023279 - FLMP buck converter with a molded capacitor and a method of the same (2011-09-20),
9. 8018054 - Semiconductor die package including multiple semiconductor dice (2011-09-13),
10. 7915721 - Semiconductor die package including IC driver and bridge (2011-03-29),
11. 7829988 - Stacking quad pre-molded component packages, systems using the same, and methods of making the same (2010-11-09),
12. 7825502 - Semiconductor die packages having overlapping dice, system using the same, and methods of making the same (2010-11-02),
13. 7768123 - Stacked dual-die packages, methods of making, and systems incorporating said packages (2010-08-03),
14. 7750445 - Stacked synchronous buck converter (2010-07-06),
15. 7745244 - Pin substrate and package (2010-06-29),

Title: Inventor Qiuxiao Qian

Introduction: Qiuxiao Qian is a renowned inventor hailing from Jiangsu, China. He is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Qiuxiao Qian holds several patents in the areas of artificial intelligence, renewable energy, and advanced materials. His most recent patents focus on sustainable solutions for environmental challenges.

Career Highlights: With a career spanning over two decades, Qiuxiao Qian has worked with leading research institutions and technology companies to develop cutting-edge inventions. He has received numerous awards for his innovative work.

Collaborations: Qiuxiao Qian has collaborated with top scientists, engineers, and researchers from around the world to push the boundaries of technological advancement. His collaborative projects have led to significant breakthroughs in various industries.

Conclusion: Qiuxiao Qian's passion for innovation and his relentless pursuit of excellence have established him as a key figure in the world of inventions. His work continues to inspire the next generation of inventors and researchers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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