The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Jan. 28, 2008
Applicants:

Yong Liu, Scarborough, ME (US);

William Newberry, Standish, ME (US);

Margie T. Rios, Mandaue, PH;

Qiuxiao Qian, Suzhou, CN;

Inventors:

Yong Liu, Scarborough, ME (US);

William Newberry, Standish, ME (US);

Margie T. Rios, Mandaue, PH;

Qiuxiao Qian, Suzhou, CN;

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed in this specification is a buck converter package with stacked dice and a process for forming a buck converter. The package includes a die attach pad with a low side die mounted on one surface and a high side die mounted on the opposing surface. The die attach pad is conductive, such that the drain of the low side die is connected to the source of the high side die through the pad. A controller die controls the gates of the high and low side dies. A plurality of leads extends outside of the package to permit electrical connections to the inside of the package. The high side drain is exposed to one of the surfaces of the package.


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