The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Sep. 26, 2007
Yong Liu, Scarborough, ME (US);
Howard Allen, Limington, ME (US);
Qiuxiao Qian, Jiangsu, CN;
Jianhong Ju, Gorham, ME (US);
Yong Liu, Scarborough, ME (US);
Howard Allen, Limington, ME (US);
Qiuxiao Qian, Jiangsu, CN;
Jianhong Ju, Gorham, ME (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A semiconductor die package. It includes a substrate having a first surface and a second surface, a first semiconductor die having its front surface facing the first surface of the substrate, a conductive adhesive disposed between the first semiconductor die and the first surface of the substrate, and a second semiconductor die located on the first semiconductor die. The front surface of second semiconductor die faces away from the first semiconductor die, and the back surface faces toward the first semiconductor die. A plurality of conductive structures electrically couple regions at the front surface of the second semiconductor die to conductive regions at the first surface of the substrate.