The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Feb. 06, 2008
Applicants:
Yong Liu, Scarborough, ME (US);
Qiuxiao Qian, Jiangsu, CN;
Inventors:
Yong Liu, Scarborough, ME (US);
Qiuxiao Qian, Jiangsu, CN;
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multiple-chip package has top and bottom pre-molded leadframes formed prior to the flip-chip attachment of semiconductor die to the leadframes. After die attachment, underfill is used to encase all but one surface of the die, and the top and bottom leadframes are joined together by solder bump balls with the exposed surfaces of the semiconductor dice proximate to each other.