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For the Inventor, By the Inventor

Taipei, Taiwan

Ping Cheng Hsu

This inventor holds 44 USPTO granted patents and 46 published patent applications, primarily in Semiconductor Fabrication. Top assignee: Nan Ya Technology Corporation. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ping Cheng Hsu. Retrieved from https://idiyas.com/inventor/ping-cheng-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 44 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 5

Forward Citations = 71(Granted Patents)


Location History:

  • Chung-Ho, TW (2004 - 2006)
  • Taipei Hsien, TW (2004 - 2006)
  • Jhonghe, TW (2006)
  • Taoyuan County, TW (2013)
  • Taipei, TW (2004 - 2014)
  • New Taipei, TW (2019 - 2024)

Company Filing History:

goldMedal44 out of 2,629 
 
Nan Ya Technology Corporation
 patents

Years Active: 2004-2026

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Areas of Expertise:
Semiconductor Device
Memory Array
Trench Capacitor
Contact Enhancement
Active Interposer
Landing Pad
Isolation Structure
Self-Aligning
Fabrication Method
Voltage Circuit
Deep Trench
Memory Device
44 patents (USPTO):Explore Patents
1. 12787259 - Memory device having planarized fins and method of manufacturing the same (2026-11-03),
2. 12757707 - Semiconductor device with polymer liner and method for fabricating the same (2026-10-06),
3. 12757384 - Memory cell with reduced parasitic capacitance and spacer between u-shaped liner and air gap (2026-10-06),
4. 12757383 - Memory cell with reduced parasitic capacitance and conductive via extending into source/drain region (2026-10-06),
5. 12733151 - Memory device having planarized fins and method of manufacturing the same (2026-09-08),
6. 12610805 - Semiconductor device with polymer liner and method for fabricating the same (2026-04-21),
7. 12363881 - Method for preparing memory array with contact enhancement cap (2025-07-15),
8. 11917813 - Memory array with contact enhancement cap and method for preparing the memory array (2024-02-27),
9. 11908693 - Method for preparing semiconductor device structure with lining layer (2024-02-20),
10. 11894268 - Method for fabricating semiconductor device with intervening layer (2024-02-06),
11. 11792972 - Method for preparing memory array with contact enhancement cap (2023-10-17),
12. 11610895 - Method of manufacturing a semiconductor device with self-aligning landing pad (2023-03-21),
13. 11574841 - Semiconductor device with intervening layer and method for fabricating the same (2023-02-07),
14. 11557576 - Method for fabricating semiconductor device with active interposer (2023-01-17),
15. 11521892 - Method for fabricating a semiconductor device (2022-12-06),

Title: The Innovative Journey of Ping Cheng Hsu

Introduction: Ping Cheng Hsu, a visionary inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Ping Cheng Hsu's latest patents showcase his commitment to pushing the boundaries of innovation in various fields, including electronics, telecommunications, and renewable energy.

Career Highlights: With a career spanning over two decades, Ping Cheng Hsu has established himself as a leading figure in the tech industry, with a keen focus on developing cutting-edge solutions to complex problems.

Collaborations: Throughout his career, Ping Cheng Hsu has collaborated with top research institutions, universities, and tech companies to bring his inventions to life, fostering a culture of innovation and excellence.

Conclusion: Ping Cheng Hsu's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a pioneering inventor in the global tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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