The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
May. 28, 2021
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Ping Hsu, New Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/76237 (2013.01); H01L 21/76852 (2013.01); H01L 21/76897 (2013.01); H01L 21/823481 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 29/0649 (2013.01); H01L 29/0653 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05116 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05169 (2013.01);
Abstract
The present application discloses a method for fabricating a semiconductor device with liners. The method includes providing a substrate having a first surface and a second surface opposite to the first surface, inwardly forming a trench on the first surface of the substrate, forming a plurality of liners positioned on side surfaces of the trench, forming a first insulating segment filling the trench, and removing part of the substrate from the second surface to expose the first insulating segment and the plurality of liners.