This inventor holds 12 USPTO granted patents and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2008-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Jhudong Township, Hsinchu County, TW (2009)
- Hsin-Chu Hsien, TW (2008 - 2011)
- Hsinchu County, TW (2010 - 2015)
Company Filing History:
Years Active: 2008-2015
Title: Innovations of Ping-Chang Wu
Introduction
Ping-Chang Wu is a prominent inventor based in Hsin-Chu Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on improving wafer dicing processes, which are crucial in the manufacturing of integrated circuits.
Latest Patents
Among his latest patents are two notable inventions related to scribe line structures for wafer dicing. The first patent describes a scribe line structure that includes a dielectric layer on a substrate, featuring a plurality of metal structures arranged vertically. These metal structures consist of metal layers and metal vias, with the metal vias on the dicing path having a lower metal density compared to those outside the dicing path. This design effectively addresses interlayer delamination issues during the dicing process, particularly for low-k/Cu wafers. The second patent further elaborates on the scribe line structure, emphasizing the arrangement of metal structures with varying metal densities to enhance the dicing process.
Career Highlights
Ping-Chang Wu is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His innovative work has positioned him as a key figure in advancing wafer dicing technologies. His contributions have not only improved manufacturing efficiency but also enhanced the reliability of semiconductor devices.
Collaborations
Throughout his career, Wu has collaborated with several talented individuals, including Chien-Li Kuo and Jui-Meng Jao. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.
Conclusion
Ping-Chang Wu's innovative contributions to wafer dicing technology have made a significant impact on the semiconductor industry. His patents reflect a deep understanding of the challenges faced in manufacturing processes, and his work continues to influence advancements in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile