The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
May. 13, 2009
Applicant:
Ping-chang Wu, Hsin-Chu Hsien, TW;
Inventor:
Ping-Chang Wu, Hsin-Chu Hsien, TW;
Assignee:
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/58 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract
A scribe line structure is disclosed. The scribe line structure includes a semiconductor substrate having a die region, a die seal ring region, disposed outside the die region, a scribe line region disposed outside the die seal ring region and a dicing path formed on the scribe line region. Preferably, the center line of the dicing path is shifted away from the center line of the scribe line region along a first direction.
Wu, Ping-Chang. (2011). Scribe line structure and method for dicing a wafer (U.S. Patent No. 8039367). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8039367
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile