The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2011

Filed:

Jul. 06, 2007
Applicant:

Ping-chang Wu, Hsinchu County, TW;

Inventor:

Ping-Chang Wu, Hsinchu County, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit structure is provided. The integrated circuit structure includes a dielectric layer, a conductive structure, a low-k dielectric layer and a plug. The conductive structure is disposed in the dielectric layer, having a recess portion. The low-k dielectric layer is disposed on the dielectric layer. The plug is disposed in the low-k dielectric layer and has a protruding bonding portion on the bottom of the plug. The bonding portion is extended into the dielectric layer and connected to the recess portion of the conductive structure.


Find Patent Forward Citations

Wu, Ping-Chang. (2011). Integrated circuit structure and manufacturing method thereof (U.S. Patent No. 8030778). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8030778

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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