The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Apr. 05, 2006
Ping-chang Wu, Jhudong Township, Hsinchu County, TW;
Ping-Chang Wu, Jhudong Township, Hsinchu County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A chip package structure including a substrate, a first chip and a second chip is provided. The first contacts and the second contacts of the substrate are respectively arranged to reside on a first side region and a second side region of the substrate. The first chip disposed on the substrate and has a plurality of first bonding pads arranged to reside on a first wire-bonding region of the first chip adjacent to the first contacts and are electrically connected to the first contacts via a plurality of first wires. The second chip is disposed on the first chip away from the symmetrical center of the first chip. The second chip has a plurality of second bonding pads arranged to reside on a second wire-bonding region of the second chip adjacent to the second contacts and are electrically connected to the second contacts via a plurality of second wires.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile