logo

For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Pin-Nan Tseng

USPTO Granted Patents = 19 

Average Co-Inventor Count = 2.9

ph-index = 9

Forward Citations = 346(Granted Patents)


Location History:

  • Taoyuan, TW (1995)
  • Hsin-chu, TW (1996 - 2024)

Company Filing History:

goldMedal19 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 1995-2024

Loading Chart...
19 patents (USPTO):Explore Patents
1. 11894408 - Dual facing BSI image sensors with wafer level stacking (2024-02-06),
2. 11037978 - Dual facing BSI image sensors with wafer level stacking (2021-06-15),
3. 10510597 - Methods for hybrid wafer bonding integrated with CMOS processing (2019-12-17),
4. 10453889 - Dual facing BSI image sensors with wafer level stacking (2019-10-22),
5. 9728453 - Methods for hybrid wafer bonding integrated with CMOS processing (2017-08-08),
6. 9711555 - Dual facing BSI image sensors with wafer level stacking (2017-07-18),
7. 6448649 - Multi-layer wiring structure having conductive sidewall etch stoppers and a stacked plug interconnect (2002-09-10),
8. 6169314 - Layout pattern for improved MOS device matching (2001-01-02),
9. 5952698 - Layout pattern for improved MOS device matching (1999-09-14),
10. 5866481 - Selective partial curing of spin-on-glass by ultraviolet radiation to (1999-02-02),
11. 5801096 - Self-aligned tungsen etch back process to minimize seams in tungsten (1998-09-01),
12. 5756396 - Method of making a multi-layer wiring structure having conductive (1998-05-26),
13. 5723893 - Method for fabricating double silicide gate electrode structures on (1998-03-03),
14. 5712207 - Profile improvement of a metal interconnect structure on a tungsten plug (1998-01-27),
15. 5702982 - Method for making metal contacts and interconnections concurrently on (1997-12-30),

Title: Innovations by Pin-Nan Tseng: Pioneering BSI Image Sensor Technology

Introduction

Pin-Nan Tseng, based in Hsin-Chu, Taiwan, is an innovative inventor with a significant contribution to the field of image sensor technology. With a remarkable portfolio of 19 patents, he has demonstrated his expertise and commitment to advancing technological solutions in the semiconductor industry.

Latest Patents

One of Tseng's latest patents focuses on "Dual Facing BSI Image Sensors with Wafer Level Stacking." This innovative device features two BSI (Backside Illumination) image sensor elements, along with a third element that is bonded between the two using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack on the first side of the substrate. Notably, the substrate has a photodiode region designed to accumulate an image charge in response to radiation on the second side of the substrate. This cutting-edge design allows for enhanced image sensing capabilities and further optimizes performance in various applications.

Career Highlights

Pin-Nan Tseng has developed his career at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading name in the semiconductor industry. His role at TSMC has allowed him to collaborate with some of the brightest minds in the field and contribute to innovative projects that have had a lasting impact on technology.

Collaborations

Throughout his career, Tseng has worked alongside esteemed colleagues, including Chia-Shiung Tsai and Ping-Yin Liu. These collaborations have been instrumental in advancing the development of new technologies and improving existing methods in image sensor design.

Conclusion

In summary, Pin-Nan Tseng's contributions to the field of image sensors, particularly through his patents related to BSI technology, showcase his dedication to innovation and excellence in the semiconductor industry. His collaborative efforts with other talented professionals further highlight the importance of teamwork in driving technological advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…