The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1998
Filed:
May. 19, 1997
Applicant:
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438627 ; 438628 ; 438629 ; 438643 ; 438648 ; 438660 ; 438661 ; 438670 ;
Abstract
A process for forming aluminum interconnect structures has been developed, that concentrates on alleviating the effects of the poor step coverage of the interconnect metallization, that develops in areas where aluminum overlies tungsten filled contact holes. A high pressure treatment of the aluminum based metallization layer is performed at pressures in the range of 50 to 120 Mega-pascal, to improve the coverage of the aluminum based layer, specifically in seams or voids in the underlying tungsten plugs.