Pi-Chen Shieh

Title: **Innovative Contributions of Inventor Pi-Chen Shieh**

Introduction

Pi-Chen Shieh, a notable inventor based in Hsin-Chu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of four patents to his name, he has displayed remarkable creativity and innovation in addressing challenges related to circuit integration and interconnect structures.

Latest Patents

Among his latest patents, Shieh has introduced several groundbreaking technologies. One of his key innovations is a bond pad structure designed for the via plug process. This bond pad structure enhances the reliability of interconnections between the bond pad and subsequent levels of circuit integration. It features three metal pads separated by layers of dielectric, with diamond-shaped via plugs formed between the metal pads, optimizing connectivity.

Another significant patent involves the profile improvement of metal interconnect structures on tungsten plugs. Shieh developed a process to mitigate the drawbacks of poor step coverage in aluminum interconnect metallization, particularly where aluminum overlays tungsten-filled contact holes. This innovative approach entails a high-pressure treatment of the aluminum metallization layer, significantly improving coverage in seams or voids within the tungsten plugs.

Career Highlights

Pi-Chen Shieh is associated with Taiwan Semiconductor Manufacturing Company Limited, where his inventive spirit continues to drive advancements in semiconductor manufacturing processes. His work has not only propelled the company's technological capabilities but has also contributed to the broader field of electronics.

Collaborations

In his endeavors, Shieh collaborates with talented colleagues, including Ruey-Yun Shiue and Wen-Teng Wu. These partnerships enhance the creative environment, leading to innovative solutions and furthering the progress of their projects.

Conclusion

In conclusion, Pi-Chen Shieh's contributions to the semiconductor industry through his patents exemplify his dedication to innovation and excellence. His work on bond pad structures and interconnect improvements demonstrates a profound understanding of complex technological challenges, securing his place as a leading inventor in his field.