San Jose, CA, United States of America

Paul F Smith

USPTO Granted Patents = 17 

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 795(Granted Patents)


Location History:

  • Boise, ID (US) (1976)
  • Campbell, CA (US) (2005 - 2008)
  • San Jose, CA (US) (1999 - 2010)

Company Filing History:


Years Active: 1976-2010

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17 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Paul F. Smith in Wafer Measurement Technologies**

Introduction

Paul F. Smith is a notable inventor based in San Jose, California, recognized for his significant contributions to the field of measurement technologies. With a remarkable portfolio of 17 patents, his innovative methodologies have advanced the precision in gauging the thickness of substrates and wafers, crucial in various manufacturing processes.

Latest Patents

Among Smith's latest inventions is the **Method and Apparatus for Measuring a Thickness of a Layer of a Wafer**. This technology features an eddy current sensor with first and second sensor heads strategically placed to maintain a predetermined gap for the test object. As the semiconductor wafer passes through this gap, the sensor heads gather measurements at specific sampling locations, ensuring an accurate assessment of the object's thickness through an integrated evaluation circuit.

Another noteworthy innovation is the **Apparatus and Method of Dynamically Measuring Thickness of a Layer of a Substrate**, which mirrors the functionality of his wafer measurement technology. This invention also employs an eddy current sensor and a position-sensing mechanism, streamlining the process of thickness measurement in real-time as materials are processed.

Career Highlights

Throughout his career, Paul F. Smith has worked with leading companies, including Applied Materials, Inc. His experience in such an innovative environment has allowed him to refine his skills and focus on developing technologies that enhance operational efficiencies in manufacturing.

Collaborations

Smith has collaborated with talented coworkers like Mei Yin Chang and Sujit Sharan, who have contributed to his research and innovation journey. Their teamwork has been instrumental in the successful development of several patented technologies that push the boundaries of what is currently achievable in measuring techniques.

Conclusion

In conclusion, Paul F. Smith's inventive spirit and robust portfolio of patented technologies make him a significant figure in the realm of wafer and substrate measurement. His ongoing work continues to influence advancements in manufacturing processes, showcasing the impact that dedicated inventors have on technology and industry practices.

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