The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Jan. 27, 2003
Applicant:
Inventors:
Michael Wood, San Jose, CA (US);
Barry L. Chin, Saratoga, CA (US);
Paul F. Smith, San Jose, CA (US);
Robin Cheung, Cupertino, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
A method for processing a substrate. The method generally includes forming a copper interconnect in a sacrificial layer deposited on the substrate by patterning the sacrifical layer to form an interconnect and filling the interconnect with copper. The method additionally includes removing at least a portion of the sacrificial layer upon copper interconnect formation, depositing a barrier layer on the copper interconnect, and depositing a dielectric layer on the barrier layer.