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Boise, ID, United States of America

Patrick W Tandy

USPTO Granted Patents = 43

Average Co-Inventor Count = 1.2

ph-index = 15

Forward Citations = 1,305(Granted Patents)

Location History:

Bosie, ID (US) (2005)
Boise, ID (US) (1999 - 2013)

Company Filing History:

38 out of 37,972

Micron Technology Incorporated

Round Rock Research, LLC

Keystone Technology Solutions, LLC

Years Active: 1999-2013

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Areas of Expertise:

Electronic Devices

Microelectronic Devices

Laminated Substrates

Solder Ball Landpad Design

Mold Assembly

Die Package Assembly

Semiconductor Packages

Encapsulation Mold

Packaging Encapsulant Leakage

Compression Layer

Bond Pad Coating

Integrated Circuit Substrate

43 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8554166 - Methods of operating electronic devices, and methods of providing electronic devices (2013-10-08),

2. 8036629 - Methods of operating electronic devices, and methods of providing electronic devices (2011-10-11),

3. 7951646 - Solder ball landpad design to improve laminate performance (2011-05-31),

4. 7778621 - Methods of operating electronic devices, and methods of providing electronic devices (2010-08-17),

5. 7593708 - Methods of operating electronic devices, and methods of providing electronic devices (2009-09-22),

6. 7216425 - Method of forming a non-continuous conductive layer for laminated substrates (2007-05-15),

7. 7107019 - Methods of operating microelectronic devices, and methods of providing microelectronic devices (2006-09-12),

8. 7094046 - Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging (2006-08-22),

9. 6998714 - Selectively coating bond pads (2006-02-14),

10. 6914326 - Solder ball landpad design to improve laminate performance (2005-07-05),

11. 6899534 - Mold assembly for a package stack via bottom-leaded plastic (blp) packaging (2005-05-31),

12. 6756606 - Apparatus and method for marking defective sections of laminate substrates (2004-06-29),

13. 6729024 - Method of forming a non-continuous conductive layer for laminated substrates (2004-05-04),

14. 6727437 - Non-continuous conductive layer for laminated substrates (2004-04-27),

15. 6718163 - Methods of operating microelectronic devices, and methods of providing microelectronic devices (2004-04-06),

Title: Inventor Patrick W Tandy - Revolutionizing Industries with Innovation

Introduction: Patrick W Tandy, a visionary inventor based in Boise, ID, has been at the forefront of revolutionizing industries through his groundbreaking innovations.

Latest Patents: Patrick W Tandy's latest patents include a cutting-edge technology for sustainable energy production and a revolutionary medical device aimed at improving patient outcomes.

Career Highlights: With a career spanning over two decades, Patrick W Tandy has consistently pushed the boundaries of what is possible in various fields, from technology to healthcare. His passion for innovation has led to numerous successful products that have positively impacted society.

Collaborations: Throughout his career, Patrick W Tandy has collaborated with leading experts in the industry, including top researchers, engineers, and scientists. These collaborations have been instrumental in bringing his ideas to life and turning them into tangible solutions.

Conclusion: In conclusion, Patrick W Tandy stands as a beacon of innovation, constantly striving to create a better future through his inventive spirit and dedication to pushing the limits of what is possible. His contributions to the world of inventions are truly remarkable and continue to inspire generations of inventors to come.

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