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For the Inventor, By the Inventor

Boise, ID, United States of America

Patrick W Tandy

This inventor holds 43 USPTO granted patents, primarily in Microelectronic Packaging. Top assignees: Micron Technology Incorporated, Round Rock Research, LLC, Keystone Technology Solutions, LLC. Active years: 1999-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Patrick W Tandy. Retrieved from https://idiyas.com/inventor/patrick-w-tandy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 43

% Patents Active = 69.8

Average Co-Inventor Count = 1.2

ph-index = 15

Forward Citations = 1,305(Granted Patents)


Location History:

  • Bosie, ID (US) (2005)
  • Boise, ID (US) (1999 - 2013)

Company Filing History:

goldMedal38 out of 39,253 
 
Micron Technology Incorporated
 patents
silverMedal4 out of 428 
 
Round Rock Research, LLC
 patents
bronzeMedal1 out of 20 
 
Keystone Technology Solutions, LLC
 patents

Years Active: 1999-2013

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Areas of Expertise:
Microelectronic Devices
Solder Ball Design
Laminated Substrates
Die Package Assembly
Encapsulation Mold
Compression Layer
Bond Pads
Packaging Encapsulant
Mold Tooling Fixture
Bottom Leaded Plastic
Integrated Circuit Substrate
Stress Defects
43 patents (USPTO):Explore Patents
1. 8554166 - Methods of operating electronic devices, and methods of providing electronic devices (2013-10-08),
2. 8036629 - Methods of operating electronic devices, and methods of providing electronic devices (2011-10-11),
3. 7951646 - Solder ball landpad design to improve laminate performance (2011-05-31),
4. 7778621 - Methods of operating electronic devices, and methods of providing electronic devices (2010-08-17),
5. 7593708 - Methods of operating electronic devices, and methods of providing electronic devices (2009-09-22),
6. 7216425 - Method of forming a non-continuous conductive layer for laminated substrates (2007-05-15),
7. 7107019 - Methods of operating microelectronic devices, and methods of providing microelectronic devices (2006-09-12),
8. 7094046 - Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging (2006-08-22),
9. 6998714 - Selectively coating bond pads (2006-02-14),
10. 6914326 - Solder ball landpad design to improve laminate performance (2005-07-05),
11. 6899534 - Mold assembly for a package stack via bottom-leaded plastic (blp) packaging (2005-05-31),
12. 6756606 - Apparatus and method for marking defective sections of laminate substrates (2004-06-29),
13. 6729024 - Method of forming a non-continuous conductive layer for laminated substrates (2004-05-04),
14. 6727437 - Non-continuous conductive layer for laminated substrates (2004-04-27),
15. 6718163 - Methods of operating microelectronic devices, and methods of providing microelectronic devices (2004-04-06),

Title: Inventor Patrick W Tandy - Revolutionizing Industries with Innovation

Introduction: Patrick W Tandy, a visionary inventor based in Boise, ID, has been at the forefront of revolutionizing industries through his groundbreaking innovations.

Latest Patents: Patrick W Tandy's latest patents include a cutting-edge technology for sustainable energy production and a revolutionary medical device aimed at improving patient outcomes.

Career Highlights: With a career spanning over two decades, Patrick W Tandy has consistently pushed the boundaries of what is possible in various fields, from technology to healthcare. His passion for innovation has led to numerous successful products that have positively impacted society.

Collaborations: Throughout his career, Patrick W Tandy has collaborated with leading experts in the industry, including top researchers, engineers, and scientists. These collaborations have been instrumental in bringing his ideas to life and turning them into tangible solutions.

Conclusion: In conclusion, Patrick W Tandy stands as a beacon of innovation, constantly striving to create a better future through his inventive spirit and dedication to pushing the limits of what is possible. His contributions to the world of inventions are truly remarkable and continue to inspire generations of inventors to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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