The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Oct. 01, 2001
Patrick W. Tandy, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A fabrication method for printed circuit boards is provided, in which a conductive layer of a conductive material is formed over an insulating layer. Portions of the conductive layer are removed to define a circuit pattern and at least one rail area. The rail area comprises conductive material arranged to span substantially the length of the circuit board adjacent to an associated edge thereof, and is electrically isolated from the circuit pattern. Portions of the conductive material within the rail area are eliminated such that no continuous length of conductive material extends substantially across the length of the circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile