The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Aug. 01, 2002
Applicant:
Inventor:
Patrick W. Tandy, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ; H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/16 ; H05K 1/03 ;
Abstract
Methods, memory devices, module boards and systems are disclosed utilizing a non-continuous conductive layer in their circuit board as opposed to a substrate having a continuous length of metal such as copper from one end to the other. By ensuring that a non-continuous conductive layer is no longer present in a substrate, deformation and warping of the substrate or circuit board can be reduced. This can reduce or prevent future errors in processing from occurring due to the tight tolerance required in processing of circuit boards.