The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Apr. 23, 2003
Brad D. Rumsey, Meridian, ID (US);
Patrick W. Tandy, Boise, ID (US);
Willam J. Reeder, Boise, ID (US);
Stephen F. Moxham, Boise, ID (US);
Steven G. Thummel, Boise, ID (US);
Dana A. Stoddard, Boise, ID (US);
Joseph C. Young, Boise, ID (US);
Brad D. Rumsey, Meridian, ID (US);
Patrick W. Tandy, Boise, ID (US);
Willam J. Reeder, Boise, ID (US);
Stephen F. Moxham, Boise, ID (US);
Steven G. Thummel, Boise, ID (US);
Dana A. Stoddard, Boise, ID (US);
Joseph C. Young, Boise, ID (US);
Round Rock Research, LLC, Mt. Kisco, NY (US);
Abstract
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.