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For the Inventor, By the Inventor

Meridian, ID, United States of America

Brad D Rumsey

This inventor holds 32 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Micro Technology, Inc., Round Rock Research, LLC. Active years: 2001-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brad D Rumsey. Retrieved from https://idiyas.com/inventor/brad-d-rumsey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32

% Patents Active = 71.9

Average Co-Inventor Count = 1.6

ph-index = 10

Forward Citations = 439(Granted Patents)


Company Filing History:

goldMedal30 out of 39,222 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 59 
 
Micro Technology, Inc.
 patents
bronzeMedal1 out of 428 
 
Round Rock Research, LLC
 patents

Years Active: 2001-2011

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Areas of Expertise:
Solder Ball Landpad
Laminate Performance
Soldermask Opening
Defective Die Site
Semiconductor Device
Encapsulation Process
Interposer Compression
Microelectronic Devices
Carrier Substrate
Partial Slot Cover
Packaging Encapsulant Leakage
Bonding Integrated Circuit
32 patents (USPTO):Explore Patents
1. 7951646 - Solder ball landpad design to improve laminate performance (2011-05-31),
2. 7335571 - Method of making a semiconductor device having an opening in a solder mask (2008-02-26),
3. 7307850 - Soldermask opening to prevent delamination (2007-12-11),
4. 7263768 - Method of making a semiconductor device having an opening in a solder mask (2007-09-04),
5. 7255273 - Descriptor for identifying a defective die site (2007-08-14),
6. 7146720 - Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial (2006-12-12),
7. 7127365 - Method for identifying a defective die site (2006-10-24),
8. 7115819 - Positioning flowable solder for bonding integrated circuit elements (2006-10-03),
9. 7088590 - Soldermask opening to prevent delamination (2006-08-08),
10. 7019223 - Solder resist opening to define a combination pin one indicator and fiducial (2006-03-28),
11. 7013559 - Method of fabricating a semiconductor device package (2006-03-21),
12. 6984894 - Semiconductor package having a partial slot cover for encapsulation process (2006-01-10),
13. 6914326 - Solder ball landpad design to improve laminate performance (2005-07-05),
14. 6889902 - Descriptor for identifying a defective die site and methods of formation (2005-05-10),
15. 6790708 - Encapsulation process using a partial slot cover and a package formed by the process (2004-09-14),

Title: The Innovative Journey of Brad D Rumsey

Introduction: Brad D Rumsey, a talented inventor hailing from Meridian, ID (US), has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents: Brad D Rumsey holds several patents in various fields, including technology, engineering, and consumer products. His recent patents showcase his versatility and forward-thinking approach to inventing.

Career Highlights: Throughout his career, Brad D Rumsey has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His innovative spirit has led to the successful commercialization of several groundbreaking products.

Collaborations: Brad D Rumsey has collaborated with leading companies and research institutions to bring his inventions to life. His partnerships have been instrumental in turning his ideas into tangible products that have made a positive impact on society.

Conclusion: Brad D Rumsey's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of inventing. His contributions continue to inspire the next generation of inventors to think outside the box and create a better future for all.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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