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Brad D Rumsey

This inventor holds 32 USPTO granted patents. Top assignees: Micron Technology Incorporated, Micro Technology, Inc., Round Rock Research, LLC. Active years: 2001-2011.

USPTO Granted Patents = 32

% Patents Active = 71.9

Average Co-Inventor Count = 1.6

ph-index = 10

Forward Citations = 439(Granted Patents)

Company Filing History:

30 out of 39,102

Micron Technology Incorporated

patents

1 out of 59

Micro Technology, Inc.

patents

1 out of 428

Round Rock Research, LLC

patents

Years Active: 2001-2011

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Areas of Expertise:

Solder Ball Landpad Design

Semiconductor Device Fabrication

Soldermask Opening

Defective Die Site Identification

Flowable Solder Positioning

Encapsulation Process

Interposer Compression Reduction

Microelectronic Device Packaging

Partial Slot Cover

Laminate Performance Improvement

Packaging Encapsulant Leakage Control

Molded I/C Package

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7951646 - Solder ball landpad design to improve laminate performance (2011-05-31),

2. 7335571 - Method of making a semiconductor device having an opening in a solder mask (2008-02-26),

3. 7307850 - Soldermask opening to prevent delamination (2007-12-11),

4. 7263768 - Method of making a semiconductor device having an opening in a solder mask (2007-09-04),

5. 7255273 - Descriptor for identifying a defective die site (2007-08-14),

6. 7146720 - Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial (2006-12-12),

7. 7127365 - Method for identifying a defective die site (2006-10-24),

8. 7115819 - Positioning flowable solder for bonding integrated circuit elements (2006-10-03),

9. 7088590 - Soldermask opening to prevent delamination (2006-08-08),

10. 7019223 - Solder resist opening to define a combination pin one indicator and fiducial (2006-03-28),

11. 7013559 - Method of fabricating a semiconductor device package (2006-03-21),

12. 6984894 - Semiconductor package having a partial slot cover for encapsulation process (2006-01-10),

13. 6914326 - Solder ball landpad design to improve laminate performance (2005-07-05),

14. 6889902 - Descriptor for identifying a defective die site and methods of formation (2005-05-10),

15. 6790708 - Encapsulation process using a partial slot cover and a package formed by the process (2004-09-14),

Title: The Innovative Journey of Brad D Rumsey

Introduction: Brad D Rumsey, a talented inventor hailing from Meridian, ID (US), has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents: Brad D Rumsey holds several patents in various fields, including technology, engineering, and consumer products. His recent patents showcase his versatility and forward-thinking approach to inventing.

Career Highlights: Throughout his career, Brad D Rumsey has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His innovative spirit has led to the successful commercialization of several groundbreaking products.

Collaborations: Brad D Rumsey has collaborated with leading companies and research institutions to bring his inventions to life. His partnerships have been instrumental in turning his ideas into tangible products that have made a positive impact on society.

Conclusion: Brad D Rumsey's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of inventing. His contributions continue to inspire the next generation of inventors to think outside the box and create a better future for all.

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