Company Filing History:
18 out of 37,972 
1 out of 428 Years Active: 1999-2011
Title: The Innovative Journey of Steven G Thummel: Revolutionizing Semiconductor Packaging
Introduction:
Steven G Thummel, a brilliant inventor based in Boise, Idaho, has made significant contributions to the field of semiconductor packaging with his groundbreaking patents and innovative designs. With 19 patents to his name, Thummel continues to push the boundaries of technology and enhance the performance of electronic devices.
Latest Patents:
One of Thummel's latest patents is the 'Solder ball landpad design to improve laminate performance,' a method and apparatus that enhances the shear force necessary to cause delamination of solder balls in a Ball Grid Array (BGA) package. By configuring ball pads on the substrate and utilizing conductive traces in specific configurations, Thummel's design increases the shear strength of the pad, thereby improving laminate performance.
Another notable patent by Thummel is the 'Method of fabricating a semiconductor die package having improved inductance characteristics,' which introduces a BGA package with a central cavity for housing a semiconductor die. This innovative design includes an anisotropically conductive adhesive layer, wire bonds, solder balls, and conductive vias to optimize the electrical connections within the package, ultimately enhancing inductance characteristics.
Career Highlights:
Thummel's exemplary career includes tenures at prestigious companies such as Micron Technology Incorporated and Round Rock Research, LLC. His expertise and inventive spirit have been instrumental in driving technological advancements in semiconductor packaging and solidifying his reputation as a visionary in the industry.
Collaborations:
Throughout his career, Thummel has collaborated with esteemed professionals in the field, including coworkers like Jerry Michael Brooks and Derek J Gochnour. These collaborations have fostered a culture of innovation, leading to the development of cutting-edge technologies and groundbreaking solutions in semiconductor packaging.
Conclusion:
In conclusion, Steven G Thummel's remarkable journey as an inventor has transformed the landscape of semiconductor packaging. His relentless pursuit of innovation, coupled with his creative patents and collaborations, continues to shape the future of electronic devices. Thummel's contributions underscore his commitment to excellence and his pioneering spirit in the world of technology.