Boise, ID, United States of America

Dana A Stoddard


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 69(Granted Patents)


Company Filing History:


Years Active: 2003-2011

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3 patents (USPTO):Explore Patents

Title: Dana A Stoddard: Innovator in Laminate Performance

Introduction

Dana A Stoddard is a prominent inventor based in Boise, ID (US). She has made significant contributions to the field of laminate performance, particularly in the design of solder ball landpads. With a total of 3 patents to her name, Stoddard's work has had a notable impact on the technology industry.

Latest Patents

Stoddard's latest patents focus on improving the laminate performance of solder balls in Ball Grid Array (BGA) packages. One of her key inventions is a method and apparatus designed to enhance the shear force necessary to prevent delamination of solder balls. The innovative design of the ball pads on the substrate is configured to increase this shear force. Additionally, conductive traces extending planarly from the pads are arranged in specific configurations to further enhance the shear strength of the pad.

Career Highlights

Throughout her career, Dana A Stoddard has worked with notable companies such as Micron Technology Incorporated and Round Rock Research, LLC. Her experience in these organizations has allowed her to develop and refine her innovative ideas, contributing to advancements in technology.

Collaborations

Stoddard has collaborated with several professionals in her field, including Brad D Rumsey and Patrick W Tandy. These collaborations have fostered a creative environment that has led to the development of her impactful patents.

Conclusion

Dana A Stoddard is a trailblazer in the realm of laminate performance, with her inventions paving the way for advancements in solder ball technology. Her contributions continue to influence the industry and inspire future innovations.

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