Olivier Rayssac

This inventor holds 48 USPTO granted patents and 1 published patent application and 12 EPO patents, primarily in Semiconductor Fabrication. Top assignees: S.o.i.tec Silicon on Insulator Technologies, S.o.i. Tec Silicon on Insulator Technologies, S.a., Commissariat a L'energie Atomique Et Aux Energies Alternatives. Active years: 2001-2018.

USPTO Granted Patents = 48 (Patent Applications = 1)

% Patents Active = 89.6

EPO Patents = 12 (Patent Applications = 1)

Average Co-Inventor Count = 3.0

ph-index = 11

Forward Citations = 394(Granted Patents)

Company Filing History:

23 out of 214

S.o.i.tec Silicon on Insulator Technologies

patents

15 out of 86

S.o.i. Tec Silicon on Insulator Technologies, S.a.

patents

10 out of 8,801

Commissariat a L'energie Atomique Et Aux Energies Alternatives

where one patent can have more than one assignee

Years Active: 2001-2018

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Areas of Expertise:

Monocrystalline Substrates

Layer Transfer Method

Substrate Cutting Device

Semiconductor Structure

Thermal Treatment

Detachable Substrate

Assembly Transfer

Embrittled Substrate

Chips Fabrication

Mechanical Strength

Stressed Systems

Atomic Implantation

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10002763 - Fabrication of substrates with a useful layer of monocrystalline semiconductor material (2018-06-19),

2. 8991673 - Substrate cutting device and method (2015-03-31),

3. 8507361 - Fabrication of substrates with a useful layer of monocrystalline semiconductor material (2013-08-13),

4. 8252664 - Fabrication of substrates with a useful layer of monocrystalline semiconductor material (2012-08-28),

5. 8093687 - Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer (2012-01-10),

6. 8083115 - Substrate cutting device and method (2011-12-27),

7. 8012289 - Method of fabricating a release substrate (2011-09-06),

8. 7972939 - Transfer method with a treatment of a surface to be bonded (2011-07-05),

9. 7939428 - Methods for making substrates and substrates formed therefrom (2011-05-10),

10. 7902038 - Detachable substrate with controlled mechanical strength and method of producing same (2011-03-08),

11. 7892946 - Device and method for cutting an assembly (2011-02-22),

12. 7888235 - Fabrication of substrates with a useful layer of monocrystalline semiconductor material (2011-02-15),

13. 7839001 - Methods for making substrates and substrates formed therefrom (2010-11-23),

14. 7713369 - Detachable substrate or detachable structure and method for the production thereof (2010-05-11),

15. 7670929 - Method for direct bonding two semiconductor substrates (2010-03-02),

Title: Inventor Olivier Rayssac - Revolutionizing Technology in Grenoble, FR

Introduction: Olivier Rayssac is a visionary inventor based in Grenoble, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Olivier Rayssac holds several patents in the areas of renewable energy, sustainable materials, and advanced electronics, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Olivier Rayssac has worked with leading research institutions and technology companies to develop cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Olivier Rayssac has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Olivier Rayssac's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs in Grenoble and beyond.