The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Jan. 17, 2007
Konstantin Bourdelle, Crolle, FR;
Carlos Mazure, Bernin, FR;
Olivier Rayssac, Grenoble, FR;
Pierre Rayssac, Legal Representative, Clairvaux d'Aveyron, FR;
Giséle Rayssac, Legal Representative, Clairvaux d'Aveyron, FR;
Konstantin Bourdelle, Crolle, FR;
Carlos Mazure, Bernin, FR;
Olivier Rayssac, Grenoble, FR;
Pierre Rayssac, legal representative, Clairvaux d'Aveyron, FR;
Giséle Rayssac, legal representative, Clairvaux d'Aveyron, FR;
S.O.I. Tec Silicon on Insulator Technologies, Bernin, FR;
Abstract
The invention provides methods of direct bonding substrates at least one of which includes a layer of semiconductor material that extends over its front face or in the proximity thereof. The provided methods include, prior to bonding, subjecting the bonding face of at least one substrate comprising a semiconductor material to selected heat treatment at a selected temperature and in a selected gaseous atmosphere. The bonded substrates are useful for electronic, optic, or optoelectronic applications.