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For the Inventor, By the Inventor

Tokyo, Japan

Nobuyuki Okuzawa

This inventor holds 29 USPTO granted patents and 11 published patent applications, primarily in Coil Components. Top assignees: Tdk Corporation, Headway Technologies, Incorporated, Sae Magnetics (h.k.) Limited. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Okuzawa. Retrieved from https://idiyas.com/inventor/nobuyuki-okuzawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 41.4

Average Co-Inventor Count = 4.1

ph-index = 9

Forward Citations = 410(Granted Patents)


Location History:

  • Chuo-ku, JP (2007 - 2011)
  • Tokyo, JP (2006 - 2022)

Company Filing History:

goldMedal29 out of 8,257 
 
Tdk Corporation
 patents
silverMedal12 out of 1,230 
 
Headway Technologies, Incorporated
 patents
bronzeMedal5 out of 764 
 
Sae Magnetics (h.k.) Limited
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

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Areas of Expertise:
Multilayer Coil
Laminated Coil
Inductor
Dielectric Composition
Layered Chip Package
Electronic Component
Common Mode Choke
Thin Film Device
Manufacturing Method
Coil Component
Memory Device
Heat Sink
29 patents (USPTO):Explore Patents
1. 12738404 - Multilayer coil component (2026-09-15),
2. 12640303 - Laminated coil component (2026-05-26),
3. D1126158 - Inductor (2026-05-12),
4. 12462970 - Coil component (2025-11-04),
5. 12293864 - Coil component and manufacturing method therefor (2025-05-06),
6. 12170163 - Coil component and manufacturing method therefor (2024-12-17),
7. 11508494 - Dielectric composition and electronic component (2022-11-22),
8. 11380482 - Dielectric composition and electronic component (2022-07-05),
9. 8513034 - Method of manufacturing layered chip package (2013-08-20),
10. 8324741 - Layered chip package with wiring on the side surfaces (2012-12-04),
11. 8154116 - Layered chip package with heat sink (2012-04-10),
12. 8134229 - Layered chip package (2012-03-13),
13. 8050045 - Electronic component and method of manufacturing the same (2011-11-01),
14. 7968374 - Layered chip package with wiring on the side surfaces (2011-06-28),
15. 7964976 - Layered chip package and method of manufacturing same (2011-06-21),

Title: The Innovative Mind of Nobuyuki Okuzawa

Introduction: Nobuyuki Okuzawa is a pioneering inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Nobuyuki Okuzawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: Throughout his illustrious career, Nobuyuki Okuzawa has worked with leading tech companies to develop cutting-edge solutions that have revolutionized various industries. His passion for pushing the boundaries of what is possible has led to the creation of numerous groundbreaking inventions.

Collaborations: Nobuyuki Okuzawa has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and creativity. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Nobuyuki Okuzawa's relentless pursuit of innovation and his dedication to creating a better future through technology make him a true visionary in the world of inventors. His impact on the field will continue to inspire generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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