The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Feb. 08, 2023
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Munehiro Takaku, Tokyo, JP;

Nobuyuki Okuzawa, Tokyo, JP;

Kazuya Tobita, Tokyo, JP;

Teruhiro Mitsuyasu, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01);
Abstract

Provided is a multilayer coil component in which a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface is located closer to an end surface in a first direction than a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface, and a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface is located closer to an end surface in the first direction than a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface.


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