The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Feb. 06, 2009
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Ito, Milpitas, CA (US);
Tatsuya Harada, Tokyo, JP;
Nobuyuki Okuzawa, Tokyo, JP;
Satoru Sueki, Tokyo, JP;
Hiroshi Ikejima, Hong Kong, CN;
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Ito, Milpitas, CA (US);
Tatsuya Harada, Tokyo, JP;
Nobuyuki Okuzawa, Tokyo, JP;
Satoru Sueki, Tokyo, JP;
Hiroshi Ikejima, Hong Kong, CN;
Headway Technologies, Inc., Milpitas, CA (US);
TDK Corporation, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include at least one specific pair of layer portions including a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures, each of which includes aligned preliminary layer portions, is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack.