The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2011

Filed:

Aug. 07, 2006
Applicants:

Nobuyuki Okuzawa, Tokyo, JP;

Makoto Yoshida, Tokyo, JP;

Inventors:

Nobuyuki Okuzawa, Tokyo, JP;

Makoto Yoshida, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.


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