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For the Inventor, By the Inventor

Tokyo, Japan

Naoharu Ohikata

This inventor holds 6 USPTO granted patents. Top assignees: Nippon Steel Corporation, Towa Corporation. Active years: 1991-1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoharu Ohikata. Retrieved from https://idiyas.com/inventor/naoharu-ohikata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 65(Granted Patents)


Company Filing History:

goldMedal6 out of 3,713 
 
Nippon Steel Corporation
 patents
silverMedal2 out of 82 
 
Towa Corporation
 patents
where one patent can have more than one assignee

Years Active: 1991-1992

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6 patents (USPTO):Explore Patents
1. 5153708 - Tape carrier used in tab system (1992-10-06),
2. 5150198 - Radiator for semiconductor chip (1992-09-22),
3. 5150047 - Member for use in assembly of integrated circuit elements and a method (1992-09-22),
4. 5137479 - Lead structure for packaging semiconductor chip (1992-08-11),
5. 5061074 - Apparatus for inspecting both sides of tape or sheet (1991-10-29),
6. 5031022 - Film carrier for mounting IC chips (1991-07-09),

Title: The Innovative Contributions of Naoharu Ohikata in Integrated Circuit Technology

Introduction: Naoharu Ohikata is a prominent inventor located in Tokyo, Japan, known for his significant contributions to the field of integrated circuit technology. With a portfolio of six patents, Ohikata has made remarkable advancements that have enhanced the efficiency and functionality of electronic components.

Latest Patents: Among his latest patents, one notable invention is the "Tape Carrier Used in Tab System." This innovation comprises a tape carrier designed for the assembly of integrated circuit chips using a TAB (Tape Automated Bonding) system. The carrier features multiple square frames, each containing a specific opening that precisely defines the position of the integrated circuit chip. The design allows for efficient resin molding, ensuring that the chip extends properly during the manufacturing process.

Another key patent is "Member for Use in Assembly of Integrated Circuit Elements and a Method," which outlines an apparatus for assembling and testing IC elements. This includes a substrate made of insulating material, defined IC-mounting portions, and integrated lead connections for seamless testing. Such intricate design facilitates both the assembly and functional testing of ICs.

Career Highlights: Ohikata's career is marked by his work with esteemed corporations such as Nippon Steel Corporation and Towa Corporation. His experience in these organizations has undoubtedly influenced his inventive endeavors and the technologies he has developed.

Collaborations: Throughout his career, Naoharu Ohikata has collaborated with notable colleagues, including Toshio Yamamoto and Tamio Saito. These partnerships have played a crucial role in the refinement and realization of his innovative ideas.

Conclusion: In summary, Naoharu Ohikata has established himself as a distinguished inventor within the integrated circuit technology sector. His recent patents not only advance technological capabilities but also underline the importance of collaboration and innovation in the field. His contributions reflect the ongoing evolution of electronic components and set a solid foundation for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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