The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1992
Filed:
Sep. 11, 1991
Nippon Steel Corporation, Tokyo, JP;
Towa Corporation, Tokyo, JP;
Abstract
A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprises a plurality of square frames, each including a substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, the square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends. At least two substantially rectangular first openings are formed within the mold area at a space between the square opening and an outer periphery of the mold area. A plurality of lead groups, extend from an inside of the square opening to positions adjacent to a periphery of the frame by crossing one of the first openings. At least one second opening is formed at a space between adjacent two of the first openings, and such that none of the leads extend across the second opening, thereby allowing a resin to flow therethrough in a process of resin-molding the integrated circuit chip mounted at the square opening.