The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 1992
Filed:
Mar. 14, 1991
Applicant:
Inventors:
Naoharu Ohikata, Tokyo, JP;
Toshio Yamamoto, Tokyo, JP;
Tadashi Kamiyama, Tokyo, JP;
Masashi Konda, Tokyo, JP;
Assignee:
Nippon Steel Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
439890 ; 26427217 ; 361421 ; 357 70 ; 357 72 ;
Abstract
A lead structure for packaging a semiconductor chip is provided which includes a plurality of electroconductive leads. At least one lead of an adjacent pair of electroconductive leads has at least one projecting portion which projects towards the other lead of the pair so that a tortuous path is defined between the electroconductive leads. The tortuous path minimizes outflow of molten plastic between the electroconductive leads.
Quick Actions:
Ohikata, Naoharu. (1992). Lead structure for packaging semiconductor chip (U.S. Patent No. 5137479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5137479
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile