Masashi Konda

Title: Masashi Konda: Innovator in Electrical Connection Technologies

Introduction

Masashi Konda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electrical connections, particularly in the development of innovative processes for forming ball bumps used in integrated circuits. With a total of 7 patents to his name, Konda continues to push the boundaries of technology.

Latest Patents

One of Konda's latest patents is a process and apparatus for forming ball bumps. This innovative process involves applying a small amplitude vibration to a vessel containing small balls of electroconductive material. The vibration causes the balls to jump above the vessel, allowing them to be held and arranged on a baseplate. The process includes attracting the jumping balls to openings on the baseplate that correspond to the electrode pads of a semiconductor chip. After arranging the balls, excess material is removed, and the balls are simultaneously bonded to the designated spots on the baseplate.

Career Highlights

Konda is currently employed at Nippon Steel Corporation, where he applies his expertise in electrical connection technologies. His work has been instrumental in advancing the efficiency and reliability of semiconductor manufacturing processes. Konda's innovative approaches have garnered attention within the industry, establishing him as a key figure in his field.

Collaborations

Konda has collaborated with notable colleagues, including Hiroshi Hoshiba and Kohei Tatsumi. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Masashi Konda's contributions to the field of electrical connections are noteworthy, with his innovative processes and patents paving the way for advancements in semiconductor technology. His work at Nippon Steel Corporation and collaborations with esteemed colleagues further highlight his impact on the industry.