The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 1994
Filed:
Feb. 24, 1992
Nippon Steel Corporation, Tokyo, JP;
Abstract
A semiconductor device is disclosed in which connection between electrodes of a semiconductor element and/or between a plurality of semiconductor elements can be made in one package to the utmost. More particularly, electrodes of two IC chips 12a and 12b are bonded to leader leads 16a and interconnection leads 16b.sub.5 patterned on a film. Connections of the interconnection leads 16b.sub.1 and 16b.sub.2 to 16b.sub.4 and 16b.sub.3 which are impossible by the leads, are made in such a manner that pads 24b.sub.1, 24b.sub.4 and 24b.sub.2, 24b.sub.3 formed on the interconnection leads are connected correspondingly by using bonding wires as jumping wires. After the connection, the IC chips, the leads and the bonding wires are resin-sealed over an overall region encompassed by a region 27.