The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1991
Filed:
Apr. 27, 1990
Toshio Yamamoto, Tokyo, JP;
Tamio Saito, Tokyo, JP;
Naoharu Ohikata, Tokyo, JP;
Jiro Ohno, Tokyo, JP;
Michio Osada, Uji, JP;
Nippon Steel Corporation, Tokyo, JP;
Towa Corporation, Kyoto, JP;
Abstract
An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.