Ibaraki, Japan

Nao Kamakura

USPTO Granted Patents = 9 


Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019-2023

Loading Chart...
Loading Chart...
9 patents (USPTO):Explore Patents

Title: Nao Kamakura: Innovator in Thermal Bonding Technologies

Introduction

Nao Kamakura is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to the field of thermal bonding technologies. With a total of nine patents to his name, he has established himself as a key figure in innovation within the semiconductor industry.

Latest Patents

Kamakura's latest inventions include a thermal bonding sheet and a thermal bonding sheet with dicing tape. These advancements are designed to enhance the bonding reliability of power semiconductor devices by suppressing the inhibition of sintering of metallic particles caused by organic components. The thermal bonding sheet features a precursor layer intended to transform into a sintered layer upon heating, which includes sinterable metallic particles and an organic component. Furthermore, the precursor layer is characterized by a phase separation structure that either takes on a sea-island structure or a co-continuous structure. Notably, the maximum diameter of the largest inscribed circle for each phase of the separation structure is between 1 µm and 50 µm, as observed in scanning electron microscope (SEM) images.

Additionally, he has developed a sheet and composite sheet with a pre-sintering layer, designed to alleviate stresses following sintering. The pre-sintering layer's viscosity at 90°C is not less than 0.27 MPa·s, with a thickness ranging from 30 µm to 200 µm, ensuring enhanced functional performance.

Career Highlights

Nao Kamakura currently works at Nitto Denko Corporation, a leading company known for its innovative materials and solutions in the semiconductor and electronics sectors. His work primarily focuses on the development of advanced bonding materials essential for the production of reliable semiconductor devices.

Collaborations

Throughout his career, Kamakura has collaborated with esteemed colleagues, including Yuki Sugo and Satoshi Honda. These partnerships have enabled him to leverage diverse expertise and accelerate the innovation process within his projects.

Conclusion

Nao Kamakura is a visionary inventor whose contributions to thermal bonding technologies have the potential to transform the semiconductor industry. With his innovative patents, he continues to push the boundaries of technology, ensuring enhanced reliability and performance in power semiconductor devices. His work at Nitto Denko Corporation exemplifies the spirit of innovation, driving forward the future of electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…