The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Dec. 13, 2016
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Nao Kamakura, Ibaraki, JP;

Yuki Sugo, Ibaraki, JP;

Satoshi Honda, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/16 (2006.01); B22F 7/08 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B22F 3/14 (2006.01); B32B 15/00 (2006.01); H01L 23/00 (2006.01); B23K 20/02 (2006.01); B23K 103/00 (2006.01); B23K 35/38 (2006.01); B23K 101/40 (2006.01); B23K 101/36 (2006.01); B32B 5/16 (2006.01); B32B 37/04 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/24 (2006.01);
U.S. Cl.
CPC ...
B23K 20/16 (2013.01); B22F 3/14 (2013.01); B22F 7/08 (2013.01); B23K 20/026 (2013.01); B23K 35/0222 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/36 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); B23K 35/3618 (2013.01); B32B 15/00 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 2201/01 (2013.01); B22F 2201/02 (2013.01); B22F 2201/20 (2013.01); B22F 2999/00 (2013.01); B23K 35/38 (2013.01); B23K 2101/36 (2018.08); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); B32B 5/16 (2013.01); B32B 37/04 (2013.01); B32B 37/06 (2013.01); B32B 37/1009 (2013.01); B32B 37/24 (2013.01); B32B 2305/342 (2013.01); B32B 2305/80 (2013.01); B32B 2309/022 (2013.01); B32B 2309/125 (2013.01); B32B 2309/68 (2013.01); B32B 2311/04 (2013.01); B32B 2311/08 (2013.01); B32B 2311/12 (2013.01); B32B 2311/22 (2013.01); H01L 24/27 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01);
Abstract

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.


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