Nitto-denko Corporation

Nao Kamakura

Yuki Sugo

Satoshi Honda

Mitsuaki Fusumada

Tsuyoshi Ishizaka

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 &#x3bc;m or more and 50 &#x3bc;m or less.

Thermal bonding sheet and thermal bonding sheet with dicing tape

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90&#xb0; C. of the pre-sintering layer is not less than 0.27 MPa&#xb7;s. Thickness of the pre-sintering layer is 30 &#x3bc;m to 200 &#x3bc;m.

Sheet and composite sheet

A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

Joint manufacturing method

A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device

A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5&#xb0; C./sec from 80&#xb0; C. to 300&#xb0; C. under pressure of 10 MPa, and then held at 300&#xb0; C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5&#xb0; C./sec from 80&#xb0; C. to 300&#xb0; C. under pressure of 10 MPa, and then held at 300&#xb0; C. for 2.5 minutes is in a range of 0.005 &#x3bc;mto 0.5 &#x3bc;m.

Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23&#xb0; C. to 500&#xb0; C. in an air atmosphere at a heating rate of 10&#xb0; C./min, a value obtained by subtracting a weight decrease amount (%) at 300&#xb0; C. from a weight decrease amount (%) at 500&#xb0; C. is in a range of &#x2212;1% to 0%.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23&#xb0; C. to 400&#xb0; C. in the air at a heating rate of 10&#xb0; C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

Growing community of inventors

Ibaraki, Japan

Nao Kamakura