The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Sep. 28, 2016
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Nao Kamakura, Ibaraki, JP;
Yuki Sugo, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); C09J 7/28 (2018.01); C09J 9/02 (2006.01); C09J 7/10 (2018.01); C09J 1/00 (2006.01); C09J 7/20 (2018.01); H01L 21/52 (2006.01); C08K 3/10 (2018.01); C09J 7/00 (2018.01); C08K 3/08 (2006.01); B32B 9/00 (2006.01); C09J 7/25 (2018.01); C09J 7/24 (2018.01); C09J 11/04 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09J 7/28 (2018.01); B32B 9/00 (2013.01); C08K 3/08 (2013.01); C08K 3/10 (2013.01); C09J 1/00 (2013.01); C09J 7/00 (2013.01); C09J 7/10 (2018.01); C09J 7/20 (2018.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2286 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2400/16 (2013.01); C09J 2433/00 (2013.01); C09J 2469/00 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/27 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29286 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/181 (2013.01);
Abstract
A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa·s. Thickness of the pre-sintering layer is 30 μm to 200 μm.