The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Dec. 13, 2016
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); H01L 21/52 (2006.01); B22F 7/08 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B22F 1/00 (2006.01); H01L 21/683 (2006.01); B23K 101/40 (2006.01); B23K 35/38 (2006.01); B22F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); B22F 1/0044 (2013.01); B22F 7/08 (2013.01); B23K 20/00 (2013.01); B23K 35/0233 (2013.01); B23K 35/302 (2013.01); B23K 35/3613 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); B22F 7/008 (2013.01); B22F 2999/00 (2013.01); B23K 35/383 (2013.01); B23K 2101/40 (2018.08); H01L 2021/60015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2011 (2013.01);
Abstract
A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.