The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Sep. 21, 2016
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Yuki Sugo, Ibaraki, JP;

Nao Kamakura, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); C09J 7/28 (2018.01); C09J 7/26 (2018.01); C09J 9/02 (2006.01); C09J 7/25 (2018.01); C09J 7/24 (2018.01); C09J 11/04 (2006.01); C09J 9/00 (2006.01); C09J 7/10 (2018.01); H01L 23/31 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09J 7/28 (2018.01); C09J 7/10 (2018.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 9/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2286 (2013.01); C09J 2201/61 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2400/16 (2013.01); C09J 2433/00 (2013.01); C09J 2469/00 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29286 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23° C. to 500° C. in an air atmosphere at a heating rate of 10° C./min, a value obtained by subtracting a weight decrease amount (%) at 300° C. from a weight decrease amount (%) at 500° C. is in a range of −1% to 0%.


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