The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Sep. 28, 2016
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Yuki Sugo, Ibaraki, JP;
Nao Kamakura, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); C09J 7/28 (2018.01); C09J 7/26 (2018.01); C09J 9/02 (2006.01); C09J 7/25 (2018.01); C09J 7/24 (2018.01); C09J 201/00 (2006.01); C09J 7/10 (2018.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); C09J 7/10 (2018.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 7/26 (2018.01); C09J 7/28 (2018.01); C09J 201/00 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2286 (2013.01); C08K 2201/001 (2013.01); C09J 9/02 (2013.01); C09J 2203/326 (2013.01); C09J 2205/106 (2013.01); C09J 2400/163 (2013.01); C09J 2433/006 (2013.01); C09J 2469/006 (2013.01); H01L 23/3121 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29286 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μmto 0.5 μm.