Tainan, Taiwan

Mu-Han Cheng

USPTO Granted Patents = 8 

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 57(Granted Patents)


Location History:

  • Tainan County, TW (2010)
  • Tainan, TW (2017 - 2024)

Company Filing History:


Years Active: 2010-2025

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8 patents (USPTO):Explore Patents

Title: **The Innovations of Inventor Mu-Han Cheng**

Introduction

Mu-Han Cheng is a notable inventor based in Tainan, Taiwan, recognized for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of eight patents, Cheng has been instrumental in advancing methods and structures that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Cheng's recent inventions focus on innovative wafer bonding and dicing techniques. One of his latest patents details edge-trimming methods for wafer bonding and dicing. This process involves edge-trimming the front-side peripheral region of a first wafer through a pre-bonding edge-trimming process, followed by the bonding of a second wafer. This method not only optimizes the physical bonding of the wafers but also includes a thinning process for the first wafer, ensuring that the resulting bonded assembly can be efficiently diced into semiconductor chips. Another recent patent outlines a semiconductor structure and its manufacturing method, which integrates multiple conductive and dielectric layers. This structure facilitates improved electrical performance and offers innovative design features that advance semiconductor technology.

Career Highlights

Mu-Han Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the leading semiconductor manufacturers globally. His work has not only enriched the company’s innovative endeavors but has also positioned TSMC at the forefront of semiconductor technology. With numerous patents to his credit, Cheng exemplifies the powerful intersection of creativity and technological advancement in the semiconductor industry.

Collaborations

Throughout his career, Cheng has worked alongside talented colleagues, including Chien-Chih Chen and Tzu-Shin Chen. Their collaborative efforts have contributed to the development of groundbreaking technologies that have propelled TSMC’s research and development capabilities forward. Working in such a collaborative environment has fostered innovation and has led to the successful patenting of numerous inventions.

Conclusion

Mu-Han Cheng’s contributions to the field of semiconductor technology highlight the importance of inventive spirit and collaborative research efforts. With his eight patents reflecting cutting-edge methods and structures, Cheng continues to influence advancements in the industry, solidifying his role as a leading innovator in semiconductor manufacturing.

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