The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Jan. 12, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chien-Chih Chen, Changhua County, TW;
Tsung-Yi Yang, Tainan, TW;
Chung-I Hung, Chuanhwai County, TW;
Mu-Han Cheng, Tainan, TW;
Tzu-Shin Chen, Tainan, TW;
Su-Yu Yeh, Tainan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/741 (2013.01); H01L 22/12 (2013.01); H01L 24/80 (2013.01); H01L 24/94 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/75983 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80024 (2013.01); H01L 2224/80149 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80908 (2013.01);
Abstract
A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected.