Company Filing History:
Years Active: 2020-2024
Title: Innovations by Tsung-Yi Yang: A Glimpse into Semiconductor Advancements
Introduction
Tsung-Yi Yang, an accomplished inventor based in Tainan, Taiwan, has made significant contributions to the field of semiconductors. With a total of two patents to his name, Yang has played a crucial role in advancing semiconductor technology, showcasing his expertise and innovative spirit.
Latest Patents
Yang's latest patents include a "Semiconductor structure and manufacturing method thereof." This patent outlines a semiconductor structure featuring a first conductive structure within a first layer, a dielectric structure in a second layer, and a second conductive structure with a unique concave recessed portion. These innovations improve the efficiency and functionality of semiconductor devices.
Another notable patent, "Method for bonding wafers and bonding tool," presents a systematic approach to wafer bonding. The process involves coupling two wafers to a bonding tool and detecting any bubbles formed between them. This method streamlines wafer manufacturing and enhances the integrity of the final semiconductor components.
Career Highlights
Tsung-Yi Yang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading player in the global semiconductor industry. His role at this esteemed company allows him to contribute to pioneering advancements in semiconductor technology, helping to shape the future of electronic devices.
Collaborations
Throughout his career, Yang has collaborated with talented colleagues, including Chien-Chih Chen and Mu-Han Cheng. Working alongside these professionals has enabled him to refine his inventions and bolster the innovative efforts within their teams.
Conclusion
Tsung-Yi Yang's dedication to innovation is evident through his patents and contributions to semiconductor technology. As he continues to work at Taiwan Semiconductor Manufacturing Company Limited, Yang remains a key figure in driving advancements that will influence the future of electronic devices and their applications.