The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Apr. 12, 2012
Applicants:
Mu-han Cheng, Tainan, TW;
Kuo-hsiu Wei, Tainan, TW;
Kei-wei Chen, Tainan, TW;
Ying-lang Wang, Tien-Chung Village, TW;
Inventors:
Mu-Han Cheng, Tainan, TW;
Kuo-Hsiu Wei, Tainan, TW;
Kei-Wei Chen, Tainan, TW;
Ying-Lang Wang, Tien-Chung Village, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14623 (2013.01); H01L 27/1464 (2013.01); H01L 27/14687 (2013.01);
Abstract
Semiconductor devices and back side illumination (BSI) sensor manufacturing methods are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece and forming an integrated circuit on a front side of the workpiece. A grid of a conductive material is formed on a back side of the workpiece using a damascene process.