Mohan R Nagar

USPTO Granted Patents = 12 (Patent Applications = 3)

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 81(Granted Patents)

Location History:

Milpitas, CA (US) (2003 - 2010)
Cupertino, CA (US) (2005 - 2016)

Company Filing History:

6 out of 3,715

Lsi Logic Corporation

patents

5 out of 20,333

Cisco Technology, Inc.

Years Active: 2003-2016

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9320183 - Ground lid opening on a substrate (2016-04-19),

2. 8962388 - Method and apparatus for supporting a computer chip on a printed circuit board assembly (2015-02-24),

3. 8952523 - Integrated circuit package lid configured for package coplanarity (2015-02-10),

4. 8736044 - Lid for an electrical hardware component (2014-05-27),

5. 8081484 - Method and apparatus for supporting a computer chip on a printed circuit board assembly (2011-12-20),

6. 7641776 - System and method for increasing yield from semiconductor wafer electroplating (2010-01-05),

7. 7352062 - Integrated circuit package design (2008-04-01),

8. 6946866 - Measurement of package interconnect impedance using tester and supporting tester (2005-09-20),

9. 6891392 - Substrate impedance measurement (2005-05-10),

10. 6825556 - Integrated circuit package design with non-orthogonal die cut out (2004-11-30),

11. 6717423 - Substrate impedance measurement (2004-04-06),

12. 6605954 - Reducing probe card substrate warpage (2003-08-12),

Title: Mohan R Nagar: Innovator in Chip Technology

Introduction

Mohan R Nagar is a prominent inventor based in Cupertino, CA. He has made significant contributions to the field of chip technology, holding a total of 12 patents. His innovative work has paved the way for advancements in electronic components and their applications.

Latest Patents

Among his latest patents is the "Ground lid opening on a substrate," which describes an apparatus for grounding a chip. This apparatus includes a ground lid, a ground trace, and two substances that facilitate adherence and electrical conduction. Another notable patent is the "Method and apparatus for supporting a computer chip on a printed circuit board assembly." This invention outlines a method where underfill is strategically placed to support a chip while preventing interference with adjacent components.

Career Highlights

Mohan has worked with several notable companies throughout his career, including LSI Logic Corporation and Cisco Technology, Inc. His experience in these organizations has contributed to his expertise in chip design and manufacturing.

Collaborations

Mohan has collaborated with talented individuals such as Mudasir Ahmad and Kuo-Chuan Liu. These partnerships have further enhanced his innovative capabilities and have led to the development of groundbreaking technologies.

Conclusion

Mohan R Nagar's contributions to chip technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of electronic components and systems.

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3 patents pending:

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